OCP Global Summit
About the event
Open Compute Project summit on open hardware, rack, power and cooling designs for hyperscale and AI data centres, aimed at hardware engineers, facility designers and supply-chain professionals.
Who it is for / why attend
Open Compute Project summit for the open hardware and software ecosystem, with engineering sessions and workshops on OCP projects. For engineers following open rack, power and cooling designs for hyperscale and AI data centres.
Venue
Dates and details are compiled from official organiser sources. Check the official website for the programme, admission requirements and registration status before making plans.
Read before you go
Explore the libraryHuawei Digital Power 2025
Huawei AI Data Center Reference Design
Import RD 01-21 as parametric AI-hall templates (rack kW, racks per module, module kW, redundancy of fan walls/TMUs/towers, generator and transformer counts) and as golden test cases for capacity math.
- Power distribution supports 2N, DR and BR architectures.
Vertiv 2026
Transforming Colocation Facilities to Meet Demand for AI Compute
Give the rack/pod model a liquid fraction (default about 70% for direct-to-chip) so residual air load is computed automatically.
- Average multi-node AI pod density is projected to rise from 40-100 kW to 100-250 kW.
Vertiv 2025
Vertiv 360AI High Density Reference Design #006: 2x 1.28 MW NVIDIA Blackwell DGX SuperPODs
Seed an AI-hall wizard template with: compute rack 73 kW, support rack 14 kW, liquid fraction 0.78, power 4N/3, cooling N+1, mechanical UPS 2N.
- Total IT load 2,560 kW = 2 pods x 1,280 kW.
SoSo CAD
Review your power design in SoSo CAD
Inspect supply paths, equipment loads and UPS failure scenarios in one model.
Request a demo