Liquid Cooling Technologies for Data Centers and Edge Applications
Schneider Electric · Tony Day, Paul Lin et al.
A Schneider Electric white paper that introduces liquid cooling for data centres and edge sites. It compares the five main methods on heat capture, density, retrofit friendliness and serviceability.
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Overview
The paper first explains why liquids move heat far better than air, and that this saves fan energy and enables warm-water heat rejection. Liquid cooling can use water up to 45 C (113 F), which allows compressor-free heat rejection in most climates and reduces evaporative water use. Removing or reducing server fans saves about 4 to 15% of IT energy.
It describes five main methods: two direct-to-chip (DTC) variants (single-phase and two-phase cold plates) and three immersion variants (chassis-based, tub single-phase, tub two-phase). On heat capture, DTC puts about 50 to 80% of IT heat into the liquid and the rest still needs air cooling; in typical servers 70 to 80% of heat comes from CPUs, GPUs and memory, which cold plates target. Immersion removes more than 95% of heat via liquid.
On density, an average above 20 kW per rack is possible with air but difficult; immersion handles 20 kW per rack easily and can exceed 100 kW per rack. The selection advice depends on context: for retrofit sites the paper favours rack-based direct-to-chip or chassis immersion, and for new or harsh-environment sites, immersion. This is an introductory paper: it classifies and compares methods but does not give a detailed sizing method for a specific product. The heat-capture fraction is given with different ranges in later Schneider papers (WP 279: 70 to 80%, WP 133: 60 to 90%), so it should be re-verified for the chosen architecture.
Key points
- Direct-to-chip captures about 50 to 80% of IT heat in the liquid; the rest still needs air cooling.
- Immersion removes more than 95% of heat via liquid.
- Removing or reducing server fans saves about 4 to 15% of IT energy.
- Liquid cooling can use water up to 45 C (113 F), enabling compressor-free heat rejection in most climates and less evaporative water use.
- In typical servers 70 to 80% of heat comes from CPUs, GPUs and memory, the components cold plates target.
- An average rack density above 20 kW is possible with air but difficult; immersion handles 20 kW per rack easily and can exceed 100 kW per rack.
- Five main methods: DTC single-phase, DTC two-phase, chassis immersion, tub single-phase, tub two-phase.
Using it in design
- Create a coolingMethod enum (air, rdhx, dtc_1p, dtc_2p, immersion_chassis, immersion_tub_1p, immersion_tub_2p).
- Give each method a default liquid heat capture fraction (DTC 0.7, range 0.5 to 0.8; immersion 0.95 or more) and size residual air cooling as (1 - fraction) x rack kW.
- Apply a default IT-energy credit of 8% (range 4 to 15%) for fan removal in PUE and energy models.
- Default facility water for liquid loops to 35 to 45 C, which unlocks dry coolers.
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Who should read it
Designers and decision makers evaluating liquid cooling for the first time, or choosing between retrofit and new-build methods.
Related standards
- ASHRAE TC9.9 Liquid Cooling Guidelines (W-classes)
- OCP Advanced Cooling Solutions
Publication details
- Authors
- Tony Day; Paul Lin; Robert Bunger
- Publisher
- Schneider Electric
- Year
- 2019
- Document number
- WP 265
- Document language
- English
- Source type
- Manufacturer
- Access
- Free to read
- Licence
- Copyright retained; citation only — the publisher’s terms apply to the original document
Citation
Tony Day; Paul Lin; Robert Bunger (2019). Liquid Cooling Technologies for Data Centers and Edge Applications. Schneider Electric. WP 265. https://download.schneider-electric.com/files?p_Doc_Ref=SPD_VAVR-AQKM3N_EN
Events on this subject
- ISK-SODEX Istanbul 2027
- SC26 – International Conference for High Performance Computing, Networking, Storage and Analysis
- ASHRAE Winter Conference
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