Five Reasons to Adopt Liquid Cooling
Schneider Electric · Paul Lin, Tony Day
A Schneider Electric white paper arguing that chip density is not the only reason to move to liquid cooling: low PUE targets, space constraints, harsh environments and water restrictions are equally valid.
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Overview
The paper pushes back on the common view that liquid cooling is only for high-density chips. It names five reasons: chip density, low PUE targets, space constraints, harsh environments and water restrictions. They are treated as separate decision triggers, so even a low-density site may have a reason to evaluate liquid cooling. The practical limit of air cooling is taken from The Green Grid's guidance: 15 to 25 kW per rack, with 20 kW per rack as its air-cooled reference.
Beyond that, active rear-door heat exchangers (RDHx) support up to about 40 kW per rack, and row-based units up to about 67 kW in HPC cases. Liquid cooling supports racks of 100 kW and more. Direct-to-chip (DTC) removes 70 to 80% of IT heat and immersion more than 95%. On energy and water, fan removal lowers server energy by about 4 to 15% (8% is typically used in analysis).
Warm water (above 30 C, up to 45 C) allows simple dry coolers and full economization in most climates, eliminating cooling-tower water. The paper also covers footprint compaction and sealed immersion for dusty or corrosive edge sites. This is a justification paper: it lays out reasons and limits rather than computing cost or PUE for a particular facility. On DTC heat capture this paper says 70 to 80%, WP 265 says 50 to 80% and WP 133 says 60 to 90%; that spread needs to be handled explicitly in design.
Key points
- The Green Grid suggests 15 to 25 kW per rack as the practical limit for air cooling, with 20 kW per rack as its air-cooled reference.
- Active rear-door heat exchangers support up to about 40 kW per rack; row-based units up to about 67 kW in HPC cases.
- Liquid cooling supports racks of 100 kW and more.
- Fan removal lowers server energy by about 4 to 15% (8% typically used in analysis).
- DTC removes 70 to 80% of IT heat; immersion more than 95%.
- Warm water (above 30 C, up to 45 C) allows simple dry coolers and full economization in most climates, eliminating cooling-tower water.
Using it in design
- Use 20 kW per rack (the Green Grid midpoint) as the default threshold at which the wizard recommends evaluating liquid cooling.
- Recommend liquid cooling strongly above 40 kW per rack, the RDHx limit.
- Add non-density triggers: PUE target below 1.2, a water-restricted site (WUE target near 0), a harsh or edge environment, or a space-constrained site.
- Note the conflict on DTC heat capture (WP 279: 70 to 80%, WP 265: 50 to 80%, WP 133: 60 to 90%); default to 0.75 and allow a user override.
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Who should read it
Designers and decision makers weighing liquid cooling for reasons beyond density, such as PUE, water, space or environment.
Related standards
- The Green Grid liquid cooling guidance
- ASHRAE TC9.9 Liquid Cooling Guidelines
Publication details
- Authors
- Paul Lin; Tony Day
- Publisher
- Schneider Electric
- Year
- 2019
- Document number
- WP 279
- Document language
- English
- Source type
- Manufacturer
- Access
- Free to read
- Licence
- Copyright retained; citation only — the publisher’s terms apply to the original document
Citation
Paul Lin; Tony Day (2019). Five Reasons to Adopt Liquid Cooling. Schneider Electric. WP 279. https://download.schneider-electric.com/files?p_Doc_Ref=SPD_WTOL-B9RKEA_EN
Events on this subject
- Data Centre World Frankfurt
- SC26 – International Conference for High Performance Computing, Networking, Storage and Analysis
- iMasons Climate Accord Summit
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